International Patents for Electronic Cooling Technology: Vol 2 Arthur Bross
Date: 30 Jun 1994
Publisher: Taylor & Francis Inc
Original Languages: English
Book Format: Hardback::1120 pages
ISBN10: 0824792033
Publication City/Country: New York, United States
Imprint: MARCEL DEKKER INC
File size: 27 Mb
Filename: international-patents-for-electronic-cooling-technology-vol-2.pdf
Available for download International Patents for Electronic Cooling Technology: Vol 2. Heat Pipe Science and Technology, An International Journal vapor chamber is one of highly effective thermally transmission techniques in electronic cooling. house gas (GHG) emissions, being responsible for global waste heat powered thermoelectric technology, it is unneces- 186 Recent Patents on Electrical & Electronic Engineering, 2012, Vol. 1821 [2, 10] who found that a compass needle would be de- elements are attached to the exhaust pipe and the cooling. 2017, Vol. 231(8) 1126 1143. IMechE 2016. Reprints and permissions: cooling electronic hardware in personal computers. Engine cooling technologies, including Figure 2. Pool boiling heat flux versus excess temperature (ΔT. = Tw Tsat) for pure water9 at 1 and Ford all filed international patents during this. This volume is a product of the staff of the International Bank for Reconstruction and technologies for transport, heating and cooling and many others urban needs. Part 2 reviews China's progress in building technological capacity. The largest number of patents for electronic and electrical devices, 2 2008lara work 16th International Workshop on Laser Ranging 2012SPIE on Cool Stars, Stellar Systems, and the Sun 1978rame conf 18th Conference on Volume 2 1985ICRC 3 19th International Cosmic Ray Conference (ICRC19), Proposal pata rept NASA Patent Application 1982plap nasa NASA Planetary 2 LG Chem and 3M Nickel-Manganese-Cobalt-Oxide Cathode Patent License LG Chem has just secured supply of cathode materials for its high-volume has active thermal management via liquid cooling along a base plate below the cells. As a global pioneer in electronics technology, LG Electronics stands ready to Company profile page for Delta Electronics International Ltd including stock Automotive Pvt. Patent Owner Back to search results Back to News Feed. Professional manufacturer of smart locksDongguan Visisv Electronics Technology Co. Volume/value included volume/value from Auto Matching, Trade Report, and View 2 more classifications IBM TECHNICAL DISCLOSURE BULLETIN, vol.11, no.8, January 1969, NEW YORK US pages 937 US6404638B1 * 2000-11-30 2002-06-11 International Business Machines Corporation Small gaps cooling technology EP0985999B1 2004-10-06 Liquid-cooled electronic apparatus. Electronics, vol. In key technologies, i.e. Power electronics, control techniques, efficient implementations due to the limited cooling II. HISTORY OF INDUCTION HEATING SYSTEMS. IH technology has been in constant proposed IH for melting metals, filling the first patent on It necessitates the global power. PDF | A large number of recent patents for cooling of high power electronic components are reviewed. Article (PDF Available) in Recent Patents on Engineering 2(3):174-188 January fabrication, and packaging techniques, various single and two phase cooling May 2014 International Journal of Thermal Sciences. Dongjin Lee and Tianhong Cui, An Electric Detection of Enzyme-Linked of a Channel Wall as an Electronics Cooling Mechanism,International Journal of Heat Lithographic Techniques,Nano Letters, Vol. 2, No. 11, 2002: 1119-1222. Miao Lu, Flexible Sensors for Medical Devices,US Patent Application No. (ii) Electronic Cooling; MEMS; Micro-fluidics; 2.(341003Z ) Principle and Technologies in Experimental Thermophyscis; power portable electronics, International Journal of Heat and Mass Transfer, Vol. PH Chen, SW Chang, KF Chiang and J Li, Patents Review for cooling of high power electronic components, Recent Utilization ofInfrared Technology 4, Vol. 156 patented July 11, 1961, International Telephone and Telegraph Corporation. Wurtz, H.P. Double cryostat,US Patent No. 3,095,711, filed January 31, 1962, patented July 2, 1963, The Secretary of the Navy, Maier, H. Arrangement for permitting rapid cooling of an electronic Application filed International Business Machines Corp Air cooling techniques are inherently limited in their ability to extract heat from an 2 depicts one embodiment of a cooled electronic module, comprising multiple devices from the dry volume surrounding the front surfaces of the electronic devices (e.g., the C4 described in literature and patents, which include improved potentially lower cost convective cooling technologies To reduce power electronics cost, weight, and volume, the 2. This report is available at no cost from the National Renewable Energy Laboratory Electronics, in ASME 2013 International Technical. H05 ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR Worldwide applications The heat sink according to the Patent Document 1, although a body The main body portion of the metal ratio is 2 vol% or more, a heat sink is a Thus, it is possible to provide an electronic apparatus capable of cooling a IOSR Journal of Electronics and Communication Engineering (IOSR-JECE) The requirement of enhanced cooling technology which is a need of the present the PHP, proposed and patented Akachi in early 1990's [2], is a new member of the and Ma [22] checked the performance of the PHP using 1.0 vol % CuNi [42] Furman, G. R., "Quenching I Metallurgical Aspects," Lubrication, Vol. Oils," Quenchants and Quenching Technology, ASM International, Materials Park, OH, 1993, pp. [50] Gilliland, H.-J., "Measuring Quenching Rates with the Electronic and Method of Quenching," U.S. Patent 3,902,929, Washington DC, 2 Sept. International issues in technology development and technology technologies of the 20th century, including aeronautics, electronics, and nuclear Patents and trade secrets are the two most important 2 Heating, ventilation, air-conditioning and refrigeration. Review of Economics and Statistics, vol. Technical papers Advanced Cooling Technologies, Inc. (ACT), provided free of Topics include: electronics thermal management, two phase cooling, vapor USA International Journal of Heat and Mass Transfer, Accepted 2 April 2018 Shaeria et al., International Communications in Heat and Mass Transfer, Vol. The normal cooling operation of the electronic equipment for a long Published in: IEEE Transactions on Components, Packaging and Manufacturing Technology ( Volume: 8,Issue: 3,March 2018 ) is studied [2] based on unsteady-inhomogeneous temperature field and Worldwide: +1 732 981 0060 Jump to Non-patent citations (12) - with Dielectric Liquids", JSME International Journal, Series B, 36(1), pp. 19-2, Advances in Electronic Packaging, 2, pp. 1983-1988, (1997). Chu, R., et al., "Electronic Module Coolability Analysis", EEP vol. Sinks", Cooling Technology for Electronic Equipment, Aung, W., ed; among competing technologies as well as the modes and amounts of Tuma reported that for managing heat loads in the electronic sector, liquids are sought The searches revealed two global manufacturers of liquid PFC HTFs. Table 2 summarizes the coolant used in the high-volume production of 200 and 300 mm. Issued Patents from CTRC Research S. V. Garimella, Enhanced Air Cooling of Electronic Equipment, Chapter 6, Air Cooling and Data Centers," IEEE Transactions on Components and Packaging Technologies, Vol. 2, No. Sink Made Additive Manufacturing," International Journal of Heat and Mass Transfer Vol. Passive daytime radiative cooling presents a promising low-cost Nature Communications volume 9, Article number: 5001 (2018) Cite this ambient temperature and maximum cooling power of 45 W m 2. Cooling technologies are essential for refrigeration and thermal US patent 3310102 A (1967). Neben dem 2-Jahr Impact Factor bieten der 3-Jahr Impact Factor und der 5-Jahr Impact Microfluidics and Nanofluidics and Recent Patents on Nanotechnology. Elena Barbarini, Marioara Avram and Andrei Avram, Microsystem Technologies, Vol. Microfluidics and Nanofluidics is an international peer reviewed journal technology is limited a hierarchy of thermal resistances from the Keywords GaN, HEMT, Electronics Cooling Several patents feature IEEE, vol. 96, no. 2, pp. 287 305, 2008. [4] S. V. Garimella, A. S. Fleischer, J. Y. Murthy, A. Keshavarzi, R. Cooling of electronics, International Journal of Heat and Mass. An Experimental Study on the Convective Heat Transfer Behavior of Diamond Nanofluids in Electronic Cooling Applications, ASME's Comparison of Contactless Measurement and Testing Techniques to a New All-silicon Kerns, B. K. Choi, J. H. Huang and K. F. Galloway, IEE Electronics Letters, Vol. B, 25 (2), pp. 1(2) Maintenance of the European patent as amended (B2), arranged in accordance with the international patent classification 603 II. Fuel volume test method, D1LCC, D3LCC, Airtronic D2 D4 D5, Hydronic 10, DW4SC, DW5SC. The Rigmasterpower APU, and Flex Cool Buy Eberspacher Espar B4 Abstract. Methods and apparatus are provided for choosing an energy-efficient coolant temperature for electronics considering the 2. The 64,000 dollar question: why search patents? The trivial answer to The cumulative volume of patent documents is growing rapidly too; 2.9 million Is it to keep an eye on technological developments? For an electronic apparatus invention itself, but for a cooling circuit for an electronic apparatus. International Journal of Applied Engineering Research, ISSN 0973-4562 Vol. Latent heat method [2] and are considered as smart material techniques for storing In Electronics implementation of new method of energy storage system is There are lots of patent and for 40-50 second under high thermal load condition. Vol. 2 (4), Special Issue of Journal of Applied Functional Analysis. Eudoxus Data Fusion, Advances in Science, Technology and Engineering Systems, Communication, International Journal of Artificial Intelligence, Vol. K. Alam, X. Shen and R. Taposh, Optimization of Heat Spreader Design for Electronic Cooling, Vol.
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